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- W2057647552 abstract "We have developed a new oxygen radical source based on the reactive sputtering phenomena of a titanium target for high rate deposition of TiO2 films. In this oxygen radical source, oxygen radicals are mainly produced by two mechanisms: selective sputter-emission of oxygen atoms from the target surface covered with a titanium oxide layer, and production of high-density oxygen plasma in the space near the magnetron-sputtering cathode. Compared with molecular oxygen ions, the amount of atomic oxygen radicals increased significantly with an increase in discharge current so that atomic oxygen radicals were mainly produced by this radical source. It should be noted that oxygen atoms were selectively sputtered from the target surface, and titanium atoms sputter-emitted from the target cathode were negligibly small. The amount of oxygen radicals supplied from this radical source increased linearly with increasing discharge current, and oxygen radicals of 1 × 1015 atoms/s/cm2 were supplied to the substrate surface at a discharge current of 1.2 A. We conclude that our newly developed oxygen radical source can be a good tool to achieve high rate deposition and to control the structure of TiO2 films for many industrial design applications." @default.
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- W2057647552 date "2012-09-04" @default.
- W2057647552 modified "2023-09-26" @default.
- W2057647552 title "New oxygen radical source using selective sputtering of oxygen atoms for high rate deposition of TiO2 films" @default.
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- W2057647552 doi "https://doi.org/10.1116/1.4748803" @default.
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