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• W2057875415 abstract "The purpose of studying is to confirm the reliability criteria of ultrasonic bonding with different chip size. To ensure this purpose, three kinds of specimens are prepared for compared evaluation, and bonding condition is secured by reliability assessment. For testing, chips are created with 5 mm × 5 mm, 10mm × 10mm, and 15mm × 15mm. The bond interconnections between chip and substrate are designed more than fifteen points with different daisy chain. Substrates called PCBs also prepared to fit each chip. The ultrasonic bonding process is progressed to use the anisotropic conductive films (ACF). For comparing the bonding process, all specimens also progressed using thermo-compression bonding." @default.
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• W2057875415 date "2012-08-01" @default.
• W2057875415 modified "2023-09-27" @default.
• W2057875415 title "A study of ultrasonic bonding flip chip process and its reliability for low temperature interconnection" @default.
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• W2057875415 doi "https://doi.org/10.1109/icept-hdp.2012.6474865" @default.
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