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W2058082507 abstract "We studied the effects of surface treatment using vacuum ultraviolet (VUV) and formic acid vapor for SnCu-Au flip-chip bonding. Sn-rich solder bumps are widely used for flip-chip interconnections because of low melting temperature and high mechanical strength. For fine pitch interconnections, surface modification is needed before the bonding process. X-ray Photoelectron Spectroscopy (XPS) and Auger Electron Spectroscopy (AES) were used to investigate Sn surfaces. The results showed how the VUV/O 3 surface treatment removes the carbon-based organic contaminants from the Sn surfaces and the formic acid treatment reduces the metal oxides of Sn. Combination of VUV/O 3 and formic acid treatments improved shear strength of a bonded sample. The average shear strength of each bump with VUV/O 3 and/or formic acid treatment is about twice that of a bump with no treatment." @default.
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W2058082507 date "2011-10-01" @default.
W2058082507 modified "2023-10-03" @default.
W2058082507 title "Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment" @default.
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W2058082507 doi "https://doi.org/10.1109/isapm.2011.6105704" @default.
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