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- W2058177399 endingPage "16" @default.
- W2058177399 startingPage "1" @default.
- W2058177399 abstract "SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed." @default.
- W2058177399 created "2016-06-24" @default.
- W2058177399 creator A5042420207 @default.
- W2058177399 creator A5066599847 @default.
- W2058177399 date "2015-01-01" @default.
- W2058177399 modified "2023-10-18" @default.
- W2058177399 title "Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging" @default.
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- W2058177399 doi "https://doi.org/10.1155/2015/639028" @default.
- W2058177399 hasPublicationYear "2015" @default.