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- W2059121261 abstract "Here we report a new thermal dry etch process for copper using hydrogen peroxide (H<SUB>2</SUB>O<SUB>2</SUB>) and hexafluoroacetylacetone (hfacH). The H<SUB>2</SUB>O<SUB>2</SUB> oxidizes copper to form either copper(I)oxide or copper(II)oxide depending on the etch temperature followed by removal of the copper oxide by hfacH resulting in formation of volatile copper(bis- hexafluoroacetylacetonate) [Cu(hfac)<SUB>2</SUB>] etch species and water. Copper has been successfully etched by this process at temperatures as low as 150 degree(s)C and etch rates of up to approximately micrometers /min at 190 degree(s)C." @default.
- W2059121261 created "2016-06-24" @default.
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- W2059121261 date "1994-09-09" @default.
- W2059121261 modified "2023-09-23" @default.
- W2059121261 title "<title>New route to thermal dry-etching of copper using hydrogen peroside (H<formula><inf><roman>2</roman></inf></formula>O<formula><inf><roman>2</roman></inf></formula>) and hexafluoroacetylacetone (HFACH)</title>" @default.
- W2059121261 doi "https://doi.org/10.1117/12.186073" @default.
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