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- W2059408042 abstract "Electromigration (EM) tests have been performed to assess the interconnect reliability of a TiN/Cu/TiN/Ti structure. In this paper we demonstrate the feasibility of Cu interconnects and we present the first electrical results. An energy activation close to 1.2 eV was found for the grain boundary diffusion. We explain the variation in the Black parameters with the different conditions applied for the reliability tests. Particular attention is paid to the dependence of the activation energy on current densities and width." @default.
- W2059408042 created "2016-06-24" @default.
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- W2059408042 date "1996-07-01" @default.
- W2059408042 modified "2023-09-25" @default.
- W2059408042 title "ELECTROMIGRATION OF INTERCONNECTS OF A TiN/Cu/TiN/Ti STRUCTURE" @default.
- W2059408042 doi "https://doi.org/10.1002/(sici)1099-1638(199607)12:4<305::aid-qre41>3.0.co;2-1" @default.
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