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• W2059755061 abstract "Cubic octameric silsesquioxanes, because of their octahedral structures and nanometer size, represent potentially very useful nanoconstruction sites. Here we report the reaction of octaaminophenylsilsesquioxane (OAPS) with a variety of epoxides and dianhydrides and their subsequent heat treatment to form nanocomposite films with exceptional oxygen barrier properties. While solution-cast films give relatively low oxygen transmission rates (OTR), casting followed by warm-pressing lowers the OTR to values competitive with commercially available high-performance barrier films. The lowest OTR measured was obtained with a warm-pressed bilayer films consisting of OAPS/tetraglycidyl-m-xylenediamine and OAPS/2,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate with OTRs < 1 cm3 20 μm/(m2 day atm). These silsesquioxane films are thermally very robust, particularly the OAPS/imide films (>500 °C when fully cured), making them ideal for electronics packaging and encapsulation applications." @default.
• W2059755061 created "2016-06-24" @default.
• W2059755061 creator A5018397055 @default.
• W2059755061 creator A5036638122 @default.
• W2059755061 date "2007-01-04" @default.
• W2059755061 modified "2023-09-23" @default.
• W2059755061 title "Silsesquioxane Barrier Materials" @default.
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• W2059755061 doi "https://doi.org/10.1021/ma062305p" @default.
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