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• W2059808466 abstract "A wireless interface by inductive coupling achieves aggregated data rate of 195 Gb/s with power dissipation of 1.2W among 4-stacked chips in a package where 195 transceivers with the data rate of 1 Gb/s/channel are arranged in 50-/spl mu/m pitch in 0.25-/spl mu/m CMOS technology. By thinning chip thickness to 10/spl mu/m, the interface communicates at distance of 15 /spl mu/m at minimum and 43 /spl mu/m at maximum. A low-power single-end transmitter achieves 55% power reduction for multiple connections. The transmit power is dynamically controlled in accordance with communication distance to reduce not only power dissipation but also crosstalk." @default.
• W2059808466 created "2016-06-24" @default.
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• W2059808466 date "2006-01-01" @default.
• W2059808466 modified "2023-10-14" @default.
• W2059808466 title "A 195-Gb/s 1.2-W Inductive Inter-Chip Wireless Superconnect With Transmit Power Control Scheme for 3-D-Stacked System in a Package" @default.
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• W2059808466 doi "https://doi.org/10.1109/jssc.2005.858625" @default.
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