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• W2060129332 abstract "Modeling of gold microbeams for characterizing MEMS packaging solutions in terms of strains induced to the MEMSdevices as well as hermetic sealing capability is presented. The proposed test structures are meant to be manufactured bythe surface micromachining front-end technology available at FBK. They are based on arrays of rectangular-shapedcantilever beams as well as clamped-clamped bridges, with a width of 20 μm and a length ranging from 100 to 400 μm,to be realized by a 2 μm thick film of electroplated gold. The resonant frequency of the microbeams is modeled by FEMsimulations as a function of substrate deformations, which could be induced by the package. Clamped-clamped bridgesshow a linear change with respect to the square of the resonant frequency up to 1800 ppm/μstrain in case of in-planedeformations. The impact of temperature excursions is also simulated, in order to use these structures for assessingthermally induced deformations. Cantilever beams are modeled as variable capacitors to detect out-of-planedeformations. Finally, both an analytical model and FEM simulations are used to study cantilever beams as resonatorsfor detecting pressure changes, showing an impact on the quality factor in a range from 1-2 bar down to 10 -3 -10 -2 mbar." @default.
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• W2060129332 date "2011-05-04" @default.
• W2060129332 modified "2023-09-23" @default.
• W2060129332 title "Modeling of gold microbeams for characterizing MEMS packages" @default.
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• W2060129332 doi "https://doi.org/10.1117/12.887571" @default.
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