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- W2060532829 abstract "Ultrasonic wirebond pull test failures were identified on 7 of 30 development lots receiving a rapid thermal processed (RTP) titanium nitride (TiN) barrier metal (as part of the metal film stack) over a 16 month period. In some cases, the pull test failures occurred at forces less than the minimum requirement of 2.5 grams. The failures were intermittent in wafer location and resulted in exposed borophosphosilicate glass (BPSG) under the metal pads. No trends were found with product type, process dates or sequence, or processing equipment, (BPSG, metal deposition or RTP). The faulty films did not fail tape peel adhesion tests, and thus could not be identified by that technique. The problem was found to be related to an interaction between the titanium and BPSG during the RTP nitridation process. Our experiments, analytical studies and literary surveys suggest that a dopant in BPSG either embrittles the TiN (or interfacial glass) through consumptive segregation or enhances the BPSG flow properties during RTP, creating a weakly adhering interfacial region after the ultrasonic action of the wirebond process. Further experiments refute the reflowing BPSG theory and somewhat substantiate the dopant segregation/embrittling phase theory.© (1994) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only." @default.
- W2060532829 created "2016-06-24" @default.
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- W2060532829 date "1994-09-09" @default.
- W2060532829 modified "2023-09-23" @default.
- W2060532829 title "<title>Wirebond pull test failures at rapid thermal processes (RTP) TiN/BPSG interface</title>" @default.
- W2060532829 doi "https://doi.org/10.1117/12.186051" @default.
- W2060532829 hasPublicationYear "1994" @default.
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