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- W2061344915 abstract "TSV is an enabler for 3D integration of smart system. This paper presented a novel silicon interposer fabrication method based on double-sided anisotropic etching of (100) oriented silicon with the features of low cost and relatively high interconnection density. A trench structure was designed to decrease the diameter of the TSV. The integration process of TSV interconnections was investigated, including wafer thinning, via formation, via metallization. All the test vehicles passed the short/open test, and the electrical resistance of the TSV is about 1.2 Ohm. The interposer was applied to the 3D packaging of GaAs photodetector and readout circuit, and the test result showed an excellent signal output." @default.
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- W2061344915 date "2014-05-01" @default.
- W2061344915 modified "2023-09-27" @default.
- W2061344915 title "Low cost fabrication of TSV-based silicon interposer using wet chemical etching and its application in 3D packaging" @default.
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- W2061344915 doi "https://doi.org/10.1109/icept.2014.6922568" @default.
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