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- W2061625129 abstract "Electro-optical printed circuit boards (EOCB) based on planar multimode polymer channels are limited by dispersion inthe step-index waveguide structures and increased optical absorption at the longer telecom wavelengths [1]. We present apromising technology for large panel EOCB based on holohedrally integrated glass foils. The planar multimode glasswaveguides patterned into these glass foils have a graded-index structure, thereby giving rise to a larger bandwidthlengthproduct compared to their polymer waveguide counterparts and lower absorbtion at the longer telecomwavelengths. This will allow glass waveguide based EOCBs to support the future bandwidth requirements inherent tolarge scale data centre and high performance computer subsystems while not incurring the same dispersion drivenpenalties on interconnect length or loss dependence on wavelength.To this end glass foil structuring technologies have been developed that are compatible with industrial PCBmanufacturing processes. Established processes as well as new approaches were analysed for their eligibility and havebeen applied to the EOCB process. In addition a connector system has been designed, which would allow opticalpluggability to glass waveguide EOCBs." @default.
- W2061625129 created "2016-06-24" @default.
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- W2061625129 date "2013-02-27" @default.
- W2061625129 modified "2023-09-23" @default.
- W2061625129 title "Embedded planar glass waveguide optical interconnect for data centre applications" @default.
- W2061625129 doi "https://doi.org/10.1117/12.2008299" @default.
- W2061625129 hasPublicationYear "2013" @default.
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