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- W2062163086 abstract "The physical and electric properties of several silver pastes, Pb-Sn solder, and indium were systematically investigated as potential binders for attaching electrodes to bismuth-based bulk or nanowire array thermoelectric elements. Scanning electron microscopy observations and x-ray diffraction surface measurements of the silver pastes were performed and the temperature and magnetic field dependence of the resistance were measured to characterize their electrical properties from 300K down to 15K and from 0to1T at 15K, respectively. The silver pastes were not reactive with bismuth and hence were found to be potentially useful as electrically conductive adhesives with bismuth-based materials. The properties of each of the binders were quite different; the typical size of the particles in the silver pastes before solidification were distributed in the range from 3nmto20μm, and the size strongly affected the resistances of the silver pastes, which were distributed over 2 and 3 orders of magnitude at 300 and 15K, respectively. Therefore, an appropriate selection of binder must be made for a specific purpose, based on the measurement results. For use with bismuth-based thermoelectric materials, the silver nanopaste is a strong candidate binder because it is far superior to other the binders examined in terms of its resistance properties and magnetic field dependence." @default.
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- W2062163086 date "2005-01-10" @default.
- W2062163086 modified "2023-10-18" @default.
- W2062163086 title "Investigation of physical and electric properties of silver pastes as a binder for thermoelectric materials" @default.
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- W2062163086 doi "https://doi.org/10.1063/1.1844691" @default.
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