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- W2063048160 abstract "Chip to chip Cu wire bonding studies have been carried out on TSLP package, with bare Cu and palladium coated copper (PCC) wire. This paper discusses on feasibility studies of Cu wire chip to chip bonding which include bump cut mode, scale lead setting and Cu bump oxidation risk assessment. From the results, it is shown that bump cut mode has significant effect to bonding results. Appropriate bump cut mode has to be selected for PCC wire in order to have a palladium coating on the bump cut surface. The PCC wire stitch pull is higher than bare Cu wire at both 0 hour and HTS168hours (200°C). Nevertheless, scale lead setting for stitch bond positioning is crucial to obtain optimum stitch bond length on bump, also avoid bonding at bump edge and wire short die. Evaluation on bump oxidation was also carried out to study the effect of Cu bump oxidation to stitch-bump interface. It is observed that higher Oxygen content on Cu bump after heat staging more than 5s without N2 gas protection. Void line is observed between stitch-bump interface for both 5s and 60s heat staging sample. No void line observed for PCC wire up to 60s heat staging. Void line between stitch-bump interface is further studied with HTS168hrs (200°C) and HTS500hrs (175°C) for void growth. Not degradation of stitch pull readings and void growth is observed." @default.
- W2063048160 created "2016-06-24" @default.
- W2063048160 creator A5012085241 @default.
- W2063048160 creator A5047534027 @default.
- W2063048160 creator A5077497302 @default.
- W2063048160 date "2013-12-01" @default.
- W2063048160 modified "2023-09-27" @default.
- W2063048160 title "Bare copper and palladium coated copper wire chip to chip bonding feasibility study" @default.
- W2063048160 cites W1983383602 @default.
- W2063048160 cites W2013240304 @default.
- W2063048160 cites W2095664284 @default.
- W2063048160 cites W2159233908 @default.
- W2063048160 cites W2533480540 @default.
- W2063048160 doi "https://doi.org/10.1109/eptc.2013.6745709" @default.
- W2063048160 hasPublicationYear "2013" @default.
- W2063048160 type Work @default.
- W2063048160 sameAs 2063048160 @default.
- W2063048160 citedByCount "0" @default.
- W2063048160 crossrefType "proceedings-article" @default.
- W2063048160 hasAuthorship W2063048160A5012085241 @default.
- W2063048160 hasAuthorship W2063048160A5047534027 @default.
- W2063048160 hasAuthorship W2063048160A5077497302 @default.
- W2063048160 hasConcept C119599485 @default.
- W2063048160 hasConcept C121598971 @default.
- W2063048160 hasConcept C127413603 @default.
- W2063048160 hasConcept C140269135 @default.
- W2063048160 hasConcept C159985019 @default.
- W2063048160 hasConcept C161790260 @default.
- W2063048160 hasConcept C165005293 @default.
- W2063048160 hasConcept C185592680 @default.
- W2063048160 hasConcept C191897082 @default.
- W2063048160 hasConcept C192562407 @default.
- W2063048160 hasConcept C2779227376 @default.
- W2063048160 hasConcept C2779772531 @default.
- W2063048160 hasConcept C502130503 @default.
- W2063048160 hasConcept C544778455 @default.
- W2063048160 hasConcept C55493867 @default.
- W2063048160 hasConcept C79635011 @default.
- W2063048160 hasConceptScore W2063048160C119599485 @default.
- W2063048160 hasConceptScore W2063048160C121598971 @default.
- W2063048160 hasConceptScore W2063048160C127413603 @default.
- W2063048160 hasConceptScore W2063048160C140269135 @default.
- W2063048160 hasConceptScore W2063048160C159985019 @default.
- W2063048160 hasConceptScore W2063048160C161790260 @default.
- W2063048160 hasConceptScore W2063048160C165005293 @default.
- W2063048160 hasConceptScore W2063048160C185592680 @default.
- W2063048160 hasConceptScore W2063048160C191897082 @default.
- W2063048160 hasConceptScore W2063048160C192562407 @default.
- W2063048160 hasConceptScore W2063048160C2779227376 @default.
- W2063048160 hasConceptScore W2063048160C2779772531 @default.
- W2063048160 hasConceptScore W2063048160C502130503 @default.
- W2063048160 hasConceptScore W2063048160C544778455 @default.
- W2063048160 hasConceptScore W2063048160C55493867 @default.
- W2063048160 hasConceptScore W2063048160C79635011 @default.
- W2063048160 hasLocation W20630481601 @default.
- W2063048160 hasOpenAccess W2063048160 @default.
- W2063048160 hasPrimaryLocation W20630481601 @default.
- W2063048160 hasRelatedWork W1515030280 @default.
- W2063048160 hasRelatedWork W1965609679 @default.
- W2063048160 hasRelatedWork W1990948816 @default.
- W2063048160 hasRelatedWork W1991390574 @default.
- W2063048160 hasRelatedWork W2003125923 @default.
- W2063048160 hasRelatedWork W2004820820 @default.
- W2063048160 hasRelatedWork W2016478358 @default.
- W2063048160 hasRelatedWork W2103164292 @default.
- W2063048160 hasRelatedWork W2106592765 @default.
- W2063048160 hasRelatedWork W2134995293 @default.
- W2063048160 hasRelatedWork W2154234190 @default.
- W2063048160 hasRelatedWork W2157262168 @default.
- W2063048160 hasRelatedWork W2167005696 @default.
- W2063048160 hasRelatedWork W2314168052 @default.
- W2063048160 hasRelatedWork W2374612806 @default.
- W2063048160 hasRelatedWork W2508936709 @default.
- W2063048160 hasRelatedWork W2560901007 @default.
- W2063048160 hasRelatedWork W2898660680 @default.
- W2063048160 hasRelatedWork W3146430617 @default.
- W2063048160 hasRelatedWork W3151228443 @default.
- W2063048160 isParatext "false" @default.
- W2063048160 isRetracted "false" @default.
- W2063048160 magId "2063048160" @default.
- W2063048160 workType "article" @default.