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• W2063054766 abstract "We have designed and fabricated micromechanical magnetometers intended for a 3D electronic compass which could be embedded in portable devices. The sensors are based on the Lorentz force acting on a current-carrying coil, processed on a single crystal silicon resonator, and they are operated in vacuum to reach high enough Q values. Sensors for all cartesian components of the magnetic field vector can be processed on the same chip. The vibration amplitude is detected capacitively and the resonance is tracked by a phase-locked-loop circuit. The fabrication process is based on aligned direct bonding of a double side polished silicon wafer and a SOI wafer. Magnetometers measuring the field component along the chip surface have a flux density resolution of about 10 nT/√Hz at a coil current of 100 μA. Magnetometers measuring the field component perpendicular to the chip surface are currently less sensitive with a flux density resolution of about 70 nT/√Hz. The standard deviation of the signal was less than 1% over a period of a few days." @default.
• W2063054766 created "2016-06-24" @default.
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• W2063054766 date "2008-04-01" @default.
• W2063054766 modified "2023-10-01" @default.
• W2063054766 title "A 3D micromechanical compass" @default.
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• W2063054766 doi "https://doi.org/10.1016/j.sna.2007.08.025" @default.
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