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• W2063058287 endingPage "3270" @default.
• W2063058287 startingPage "3254" @default.
• W2063058287 abstract "Atomic layer deposition (ALD) is a popular deposition technique comprising two or more sequential, self-limiting surface reactions, which make up an ALD cycle. Energy-enhanced ALD is an evolution of traditional thermal ALD methods, whereby energy is supplied to a gas in situ in order to convert a traditional thermal ALD co-reactant to a highly reactive species with short-term stability. Therefore, energy-enhanced ALD encompasses plasma-enhanced ALD and ozone-based ALD techniques. In this article, we aim to provide insight into precursor considerations, such that the advantages of energy-enhanced ALD can be exploited. The examples of such advantages are that a wider variety of precursors can be used, and that deposition temperatures down to room temperature with a high growth-per-cycle can be employed. The precursor freedom is demonstrated here by Ti compounds of the general formula [Ti(Cpx)L3] (Cpx = alkyl-substituted η5-cyclopentadienyl, L = OMe, OiPr or NMe2). Such heteroleptic cyclopentadienyl complexes allow for improved volatility by preventing oligomerisation and offering improved thermal stability, thereby leading to a longer storage life in bubblers and allowing for ALD at higher deposition temperatures than with analogous homoleptic precursors. However, experimental data show that [Ti(Cpx)L3] compounds are not reactive with water during ALD but do react with plasmas and ozone. Density Functional Theory calculations suggest that this is because chemisorption is prevented by the steric hindrance of the cyclopentadienyl ligand. Further processing versatility afforded by energy-enhanced ALD is also observed with depositions at low temperatures (<200 °C) and even room temperature. Such low temperatures are often not considered viable for thermal ALD as there is insufficient thermal energy to drive reactions, resulting in low growth per cycle values and relatively high film contamination. The high reactivity of plasmas and ozone allows the deposition of good to fair quality films at low temperatures with a high growth-per-cycle, exemplified by [Al(CH3)3]2 (TMA) and [Al(CH3)2(OiPr)]2 (DMAI) aluminium precursors. The considerations required for energy-enhanced room-temperature ALD (RT-ALD) are also presented here, using Al2O3, SiO2 and TiO2, from TMA, [SiH2(NEt2)2] (BDEAS) and [Ti(OiPr)4] (TTIP), as examples. The essential criterion is that incoming metalorganic precursors and co-reactant gases must be reactive with the surface groups at room temperature. As long as this is met, then further desirable conditions for RT-ALD are a high precursor vapour pressure and short purge times. Using these examples, the advantages of energy-enhanced ALD with respect to precursor choices are highlighted." @default.
• W2063058287 created "2016-06-24" @default.
• W2063058287 creator A5022165745 @default.
• W2063058287 creator A5030039866 @default.
• W2063058287 date "2013-12-01" @default.
• W2063058287 modified "2023-10-14" @default.
• W2063058287 title "Energy-enhanced atomic layer deposition for more process and precursor versatility" @default.
• W2063058287 cites W103493881 @default.
• W2063058287 cites W1547482991 @default.
• W2063058287 cites W1561385610 @default.
• W2063058287 cites W1604967701 @default.
• W2063058287 cites W1607784784 @default.
• W2063058287 cites W1644248757 @default.
• W2063058287 cites W1668040035 @default.
• W2063058287 cites W1908921139 @default.
• W2063058287 cites W195332198 @default.
• W2063058287 cites W1963968125 @default.
• W2063058287 cites W1965368032 @default.
• W2063058287 cites W1966792585 @default.
• W2063058287 cites W1968326438 @default.
• W2063058287 cites W1969224115 @default.
• W2063058287 cites W1972702808 @default.
• W2063058287 cites W1973561324 @default.
• W2063058287 cites W1973578859 @default.
• W2063058287 cites W1974105848 @default.
• W2063058287 cites W1975668908 @default.
• W2063058287 cites W1975823940 @default.
• W2063058287 cites W1976606328 @default.
• W2063058287 cites W1977000847 @default.
• W2063058287 cites W1978486074 @default.
• W2063058287 cites W1978797285 @default.
• W2063058287 cites W1981130398 @default.
• W2063058287 cites W1981832831 @default.
• W2063058287 cites W1982605596 @default.
• W2063058287 cites W1982652678 @default.
• W2063058287 cites W1983692613 @default.
• W2063058287 cites W1984434470 @default.
• W2063058287 cites W1987033728 @default.
• W2063058287 cites W1987119064 @default.
• W2063058287 cites W1987154283 @default.
• W2063058287 cites W1987166704 @default.
• W2063058287 cites W1987345373 @default.
• W2063058287 cites W1992561796 @default.
• W2063058287 cites W1992568289 @default.
• W2063058287 cites W1993343780 @default.
• W2063058287 cites W1993614411 @default.
• W2063058287 cites W1994888396 @default.
• W2063058287 cites W1995191254 @default.
• W2063058287 cites W1995908862 @default.
• W2063058287 cites W1995987129 @default.
• W2063058287 cites W1996014780 @default.
• W2063058287 cites W1996407699 @default.
• W2063058287 cites W1996462939 @default.
• W2063058287 cites W1996962917 @default.
• W2063058287 cites W1996998209 @default.
• W2063058287 cites W1997153790 @default.
• W2063058287 cites W1998883481 @default.
• W2063058287 cites W2000399637 @default.
• W2063058287 cites W2000482871 @default.
• W2063058287 cites W2001131863 @default.
• W2063058287 cites W2002808931 @default.
• W2063058287 cites W2008036069 @default.
• W2063058287 cites W2009125029 @default.
• W2063058287 cites W2010864696 @default.
• W2063058287 cites W2012734437 @default.
• W2063058287 cites W2016096739 @default.
• W2063058287 cites W2016356365 @default.
• W2063058287 cites W2016404990 @default.
• W2063058287 cites W2017685142 @default.
• W2063058287 cites W2019267643 @default.
• W2063058287 cites W2022948920 @default.
• W2063058287 cites W2023680177 @default.
• W2063058287 cites W2025034207 @default.
• W2063058287 cites W2025627705 @default.
• W2063058287 cites W2025908440 @default.
• W2063058287 cites W2026067267 @default.
• W2063058287 cites W2027105971 @default.
• W2063058287 cites W2027330917 @default.
• W2063058287 cites W2027419934 @default.
• W2063058287 cites W2029183680 @default.
• W2063058287 cites W2031695124 @default.
• W2063058287 cites W2031816757 @default.
• W2063058287 cites W2032306276 @default.
• W2063058287 cites W2035931858 @default.
• W2063058287 cites W2036203320 @default.
• W2063058287 cites W2037854947 @default.
• W2063058287 cites W2039898629 @default.
• W2063058287 cites W2041923506 @default.
• W2063058287 cites W2043864562 @default.
• W2063058287 cites W2044388626 @default.
• W2063058287 cites W2044394993 @default.
• W2063058287 cites W2044666036 @default.
• W2063058287 cites W2045064685 @default.
• W2063058287 cites W2049326648 @default.
• W2063058287 cites W2052659573 @default.
• W2063058287 cites W2053784345 @default.
• W2063058287 cites W2054550195 @default.
• W2063058287 cites W2054713559 @default.

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