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• W2063386286 abstract "An in situ electron beam (EB) lithography process using GaAs for making nanometer-scale structures is described. This process employs an ultrathin GaAs oxide layer as a mask material for Cl2 gas etching. The oxide mask can be patterned by EB irradiation under a Cl2 ambient for positive-type lithography. For negative-type lithography, an oxide mask is selectively formed by EB irradiation under an O2 ambient. To avoid surface contamination, the entire process is performed in situ in an ultrahigh-vacuum environment without exposing the wafer surface to air. By using an EB gun with a beam diameter of less than 40 nm, together with the use of ultrathin oxide mask layers, lateral patterning with a dimension as small as 100 nm has been successfully demonstrated on GaAs surfaces." @default.
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• W2063386286 date "1992-04-01" @default.
• W2063386286 modified "2023-09-26" @default.
• W2063386286 title "Patterning of GaAs by in situ electron beam lithography toward nanometer-scale structures" @default.
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• W2063386286 doi "https://doi.org/10.1088/0957-4484/3/2/002" @default.
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