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- W2063456492 abstract "A thinned-CCD mosaic was fabricated from four Loral 2048 X 2048 edge-buttable CCDs. Thinning was performed on the whole wafer with subsequent dicing and handling facilitated by bonding the thinned wafer to a glass plate. Packaging of the devices involved a `flip-chip' wire-bonding technique followed by chemical dissolution of the glass support. The fabrication process was designed to minimize the gaps between devices and retain a high degree of flatness in the finished CCDs.© (1994) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only." @default.
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- W2063456492 date "1994-05-01" @default.
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- W2063456492 title "<title>Thinned 4096x4096 CCD mosaic</title>" @default.
- W2063456492 doi "https://doi.org/10.1117/12.172760" @default.
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