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- W2063572275 abstract "The possibility of monolithic integration of microwave magnetic and semiconductor electronic components hasbeen investigated by growing spinel ferrite films on GaAs and Si using the spin-spray plating (SSP) technique.Since film deposition by SSP is performed at temperatures as low as 100 C, this process facilitatesdeposition of ferrite material without any thermal deterioration of the underlying GaAs devices. This wasdemonstrated by depositing and patterning a Ni-Zn ferrite film on a portion of a GaAs wafer containingseveral MMIC circuits.X-ray diffraction analysis of SSP-grown ferrite films indicated that the films formed different crystallographictextures at different growth temperatures. To achieve the thicker films required for practical device applications,deposition of a 25-pm-thick Ni-Zn ferrite film was demonstrated by a multiple deposition methodwith intermediate drying processes.The magnetic properties of these films, measured by ferrpmagnetic resonance (FMR) , compared well to thoseof commercially available polycrystalline material. The electrical resistivity of the films varied as a functionof their chemical composition. The dielectric loss tangent (tan 5) of the as-deposited film was observed tobe greater than ten. However, the measured resistivity dependence of dielectric loss tangent showed that thedominant microwave loss mechanism was not due to conduction alone. Post-growth annealing experimentsindicated that moisture in the films trapped during the SSP process caused high dielectric losses, and thatannealing could reduce the loss tangent value." @default.
- W2063572275 created "2016-06-24" @default.
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- W2063572275 date "1990-10-01" @default.
- W2063572275 modified "2023-09-23" @default.
- W2063572275 title "Spin-spray plating of spinel ferrite films on semiconductor substrates" @default.
- W2063572275 doi "https://doi.org/10.1117/12.21660" @default.
- W2063572275 hasPublicationYear "1990" @default.
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