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• W2063630996 abstract "Nanotwinned copper is drawing widely attention for it simultaneously demonstrates high strength, high ductility, and high conductivity. It will be very beneficial to microelectronics in many respects, one of which is redistribution layer in wafer level packaging. We take advantage of (111) preferred oriented nanotwinned copper to fabricate 2-poly-1-metal (2P1M) redistribution layer in wafer level packaging. Nanotwinned copper was deposited by pulsed electroplating. Texture of copper can be controlled by seedlayer, thickness of films, or patterns, and texture can be observed by X-ray diffraction. Microstructure and the evolution of copper after annealing were studied by focused ion beam, scanning electron microscopy, and transmission electron microscopy." @default.
• W2063630996 created "2016-06-24" @default.
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• W2063630996 date "2013-08-01" @default.
• W2063630996 modified "2023-09-28" @default.
• W2063630996 title "Fabrication and microstructure evolution of preferred oriented nanotwinned copper by pulse electroplating for RDL in WLP" @default.
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• W2063630996 doi "https://doi.org/10.1109/icept.2013.6756474" @default.
• W2063630996 hasPublicationYear "2013" @default.
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