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- W2063669183 abstract "The catalytic activity of copper, palladium‐activated copper, gold, and platinum for electro‐oxidation of hypophosphite and electroless nickel plating was investigated in an ammoniacal solution of pH 8.8 at 50°C by potential measurements and linear sweep voltammetry from −0.3 to −0.92V vs. SCE. Early stages of nickel plating on copper‐palladium substrates were studied by scanning electron microscopy in conjunction with EDAX. It was found that palladium‐activated copper and gold were catalytically active in the entire range of potentials examined; copper was active below −0.6; platinum was not active at all. Small amounts of electrolytically deposited nickel considerably increased the electro‐oxidation rate of hypophosphite on copper, gold, and palladium. TEM examinations showed that activation of copper in a solution resulted in the deposition of palladium in the form of separate patches. Electroless nickel deposition on copper substrates with separate palladium spots took place on copper and palladium independently of each other. The deposition on palladium was faster than that on copper. It was concluded that the activation of copper substrates around palladium spots occurred solely through a spontaneous potential shift, induced by electro‐oxidation of hypophosphite on the palladium spots. It was suggested that small amounts of one metal synergistically enhanced the catalytic activity of the other metals." @default.
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- W2063669183 date "1984-02-01" @default.
- W2063669183 modified "2023-09-25" @default.
- W2063669183 title "Initiation of Electroless Nickel Plating on Copper, Palladium‐Activated Copper, Gold, and Platinum" @default.
- W2063669183 doi "https://doi.org/10.1149/1.2115559" @default.
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