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- W2064071649 abstract "AbstractThe effect of CF 4 plasma treatment condition on the interfacial adhesion energy of inkjet printedAg/polyimide system is evaluated from 180 o peel test by calculating the plastic deformation energy of peeledmetal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. CF 4 plasmatreatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is causedby the increase in the surface roughness as well as the change in functional group of the polyimide film dueto CF 4 plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and thechemical bonding effect are responsible for interfacial adhesion improvement in inkjet printed Ag/polyimidesystems.Key wordsAdhesion, Peel test, Inkjet-printed Ag, Polyimide, Thin film 1. 1) , , , . !# $ % &' ()*+ ,-./ 01 & 2345 7 56 89 :; !? (micro-fabrication) @A B . CD EFG (silicon)H / -. I # !? JLM )K NO PQ !? (photolithography)# R =% S 7= Micro Electro-MechanicalSystem(MEMS)T Ultra Large-Scale Integration(ULSI)% H# 6 UV )K N W ; , 7 !? XY Z7 $7 [F , )7!?] $7 ^ . 7_R `a d bc f e* gh j i I i (droplet) k l# mn opq %j ro u st vwx 7 S KL yz . u st x vw ' S {R 4 5 !? j `| }7 , ' ]) !? ~ ( , ]7 Agj N)q F h.j ' ( < & #@A &f . R lD K N) 7= F ( c? , | . , ' < 45 d ~2 $7 N)K . _ - 7 AgT Do 7= F N7 |i £7 n¢ 89 ¤¥# ,!? ¦ (integration) c? § & ¨© a«j ¬* 7 /| o ? n¢£ |i ? ? 7 ® @A . ¢£ |in S ?¯# q_ ; d ° ' 2 ± 1 ²³ gh lN7 in¢£ | ?# 95 ]´ 7 Zµ ` , R ¶ Z·# 7 ) , µ¸ E DC 7 ¹<o @ ½ »¼ ¯S7 $7 )K N . ;W @ ½ »¼ Sd ¯ R ? @ .# ²³ # ¾? R #A; K< A < E |' in¢£ ? ¬* ?f @ .# ²³ #A;j A<+* R ." @default.
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- W2064071649 date "2007-04-01" @default.
- W2064071649 modified "2023-09-23" @default.
- W2064071649 title "A Study on Improvement of Interfacial Adhesion Energy of Inkjet-printedAg Thin film on Polyimide by CF4 Plasma Treatment" @default.
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- W2064071649 doi "https://doi.org/10.3740/mrsk.2007.17.4.215" @default.
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