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Matches in SemOpenAlex for { <https://semopenalex.org/work/W2064834140> ?p ?o ?g. }

• W2064834140 endingPage "66" @default.
• W2064834140 startingPage "61" @default.
• W2064834140 abstract "Diamond films were deposited on a p-type Si substrate by a hot-filament chemical vapor deposition method. We observed intrinsic stress of the film by creep deformation of the Si substrate, and deduced intrinsic residual stresses of films using the power-law creep equation. Thermal strain and creep strain in the Si substrate were subtracted from the total ex situ measured strain. Thermal strain was removed by the numerical method, and creep strains in the substrate were examined by measuring the curvature of Si substrates which had been removed from the diamond films by the electron cyclotron resonance etching process using oxygen plasma. The results showed that creep deformation of the Si substrates must be considered when residual stresses are measured by the curvature method. This is especially true in cases where the film was thick, or when temperature or stress conditions were high. From this study, we propose a new approach to measuring intrinsic stress from the creep deformation of substrates." @default.
• W2064834140 created "2016-06-24" @default.
• W2064834140 creator A5015018733 @default.
• W2064834140 creator A5022984463 @default.
• W2064834140 creator A5043845260 @default.
• W2064834140 creator A5052564983 @default.
• W2064834140 date "2000-01-01" @default.
• W2064834140 modified "2023-10-16" @default.
• W2064834140 title "Calculation of intrinsic stress by creep deformation of an Si substrate on chemical vapor deposited diamond films" @default.
• W2064834140 cites W1964151876 @default.
• W2064834140 cites W1973809683 @default.
• W2064834140 cites W1990038687 @default.
• W2064834140 cites W1996883633 @default.
• W2064834140 cites W1999361937 @default.
• W2064834140 cites W1999435199 @default.
• W2064834140 cites W2009803287 @default.
• W2064834140 cites W2011377228 @default.
• W2064834140 cites W2016694983 @default.
• W2064834140 cites W2017862031 @default.
• W2064834140 cites W2020356156 @default.
• W2064834140 cites W2020931032 @default.
• W2064834140 cites W2035346756 @default.
• W2064834140 cites W2039792862 @default.
• W2064834140 cites W2045570590 @default.
• W2064834140 cites W2049505511 @default.
• W2064834140 cites W2052137108 @default.
• W2064834140 cites W2055807120 @default.
• W2064834140 cites W2057535572 @default.
• W2064834140 cites W2066874036 @default.
• W2064834140 cites W2072840465 @default.
• W2064834140 cites W2087612841 @default.
• W2064834140 cites W2095322154 @default.
• W2064834140 cites W2119130957 @default.
• W2064834140 cites W2142162334 @default.
• W2064834140 cites W2169203178 @default.
• W2064834140 cites W2332580283 @default.
• W2064834140 cites W2887850214 @default.
• W2064834140 doi "https://doi.org/10.1016/s0925-9635(99)00229-0" @default.
• W2064834140 hasPublicationYear "2000" @default.
• W2064834140 type Work @default.
• W2064834140 sameAs 2064834140 @default.
• W2064834140 citedByCount "4" @default.
• W2064834140 countsByYear W20648341402022 @default.
• W2064834140 countsByYear W20648341402023 @default.
• W2064834140 crossrefType "journal-article" @default.
• W2064834140 hasAuthorship W2064834140A5015018733 @default.
• W2064834140 hasAuthorship W2064834140A5022984463 @default.
• W2064834140 hasAuthorship W2064834140A5043845260 @default.
• W2064834140 hasAuthorship W2064834140A5052564983 @default.
• W2064834140 hasConcept C100460472 @default.
• W2064834140 hasConcept C111368507 @default.
• W2064834140 hasConcept C127313418 @default.
• W2064834140 hasConcept C138885662 @default.
• W2064834140 hasConcept C149912024 @default.
• W2064834140 hasConcept C159985019 @default.
• W2064834140 hasConcept C171250308 @default.
• W2064834140 hasConcept C187059263 @default.
• W2064834140 hasConcept C192562407 @default.
• W2064834140 hasConcept C204366326 @default.
• W2064834140 hasConcept C21036866 @default.
• W2064834140 hasConcept C2776921476 @default.
• W2064834140 hasConcept C2777289219 @default.
• W2064834140 hasConcept C2779227376 @default.
• W2064834140 hasConcept C33220542 @default.
• W2064834140 hasConcept C37292000 @default.
• W2064834140 hasConcept C41895202 @default.
• W2064834140 hasConcept C47908070 @default.
• W2064834140 hasConcept C57410435 @default.
• W2064834140 hasConcept C87976508 @default.
• W2064834140 hasConceptScore W2064834140C100460472 @default.
• W2064834140 hasConceptScore W2064834140C111368507 @default.
• W2064834140 hasConceptScore W2064834140C127313418 @default.
• W2064834140 hasConceptScore W2064834140C138885662 @default.
• W2064834140 hasConceptScore W2064834140C149912024 @default.
• W2064834140 hasConceptScore W2064834140C159985019 @default.
• W2064834140 hasConceptScore W2064834140C171250308 @default.
• W2064834140 hasConceptScore W2064834140C187059263 @default.
• W2064834140 hasConceptScore W2064834140C192562407 @default.
• W2064834140 hasConceptScore W2064834140C204366326 @default.
• W2064834140 hasConceptScore W2064834140C21036866 @default.
• W2064834140 hasConceptScore W2064834140C2776921476 @default.
• W2064834140 hasConceptScore W2064834140C2777289219 @default.
• W2064834140 hasConceptScore W2064834140C2779227376 @default.
• W2064834140 hasConceptScore W2064834140C33220542 @default.
• W2064834140 hasConceptScore W2064834140C37292000 @default.
• W2064834140 hasConceptScore W2064834140C41895202 @default.
• W2064834140 hasConceptScore W2064834140C47908070 @default.
• W2064834140 hasConceptScore W2064834140C57410435 @default.
• W2064834140 hasConceptScore W2064834140C87976508 @default.
• W2064834140 hasIssue "1" @default.
• W2064834140 hasLocation W20648341401 @default.
• W2064834140 hasOpenAccess W2064834140 @default.
• W2064834140 hasPrimaryLocation W20648341401 @default.
• W2064834140 hasRelatedWork W2080008790 @default.
• W2064834140 hasRelatedWork W2094113462 @default.
• W2064834140 hasRelatedWork W2146937365 @default.
• W2064834140 hasRelatedWork W2378038125 @default.
• W2064834140 hasRelatedWork W2605709756 @default.

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