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- W2064955860 abstract "Abstract A commercially available thermal scanned probe microscope has been used to look at voids which are buried under a SiO 2 passivation layer. The microscope detects heat flow from the probe into the specimen. Results show that it is possible to detect thermal conductivity changes caused by subsurface voids at a depth of over 200 nm." @default.
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- W2064955860 date "1999-08-01" @default.
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- W2064955860 title "Detection of subsurface voids using scanning thermal microscopy" @default.
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- W2064955860 doi "https://doi.org/10.1016/s0304-3991(99)00047-9" @default.
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