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• W2065491131 startingPage "04EB01" @default.
• W2065491131 abstract "A room-temperature bonding technique using cone-shaped microbumps with the aid of ultrasonic vibration is applied to the fabrication of a near-infrared (NIR) image sensor. The image sensor is fabricated using the chip-on-chip integration of an InGaAs photodiode array on an InP substrate and a Si CMOS readout IC. The pixel pitch is 25 µm to compose quarter-VGA class (320 × 256 pixels) resolution. A high-quality imaging of a heated object is demonstrated. Bonding of the VGA array with 15 µm pitch is attempted to realize a high-resolution image sensor." @default.
• W2065491131 created "2016-06-24" @default.
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• W2065491131 date "2014-02-26" @default.
• W2065491131 modified "2023-10-17" @default.
• W2065491131 title "Room-temperature bonding of heterogeneous materials for near-infrared image sensor" @default.
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• W2065491131 doi "https://doi.org/10.7567/jjap.53.04eb01" @default.
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