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- W2065664145 abstract "A new method is described for the electroless deposition of copper onto acrylonitrile—butadiene—styrene (ABS) plastic. Etched ABS plastic was dipped directly into PdSO4 solution instead of the usual sensitization followed by activation. Experimental results show that the Pd2+ ions from PdSO4 solution are coordinated to the polar groups (i.e. COOH, SO3H—, etc.) on the surface of the etched ABS, resulting in the formation of ABSPd2+ complex. In an electroless copper bath containing a formaldehyde (HCHO) reducing agent, the ABSPd2+ complex is reduced to product Pd0 atoms, which then act as catalysts and initiate the deposition of copper metal. Initially, the copper deposition rate was slow; however, it rose to that for conventional methods in about 10 min." @default.
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- W2065664145 date "1995-01-01" @default.
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- W2065664145 title "Improved ABS plastic activating treatment for electroless copper plating" @default.
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- W2065664145 doi "https://doi.org/10.1016/0032-3861(95)99442-w" @default.
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