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- W2066250413 abstract "MEMS sensor growth in the future is expected with inevitable trend on miniaturization for smartphone and wearable devices. In this presentation, the next wave architecture of 3D IC packaging solution overview versus traditional packaging technologies will be demonstrated and discussed, for applications including MEMS." @default.
- W2066250413 created "2016-06-24" @default.
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- W2066250413 date "2015-01-01" @default.
- W2066250413 modified "2023-09-27" @default.
- W2066250413 title "Semiconductor ic packaging, the next wave" @default.
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- W2066250413 doi "https://doi.org/10.1109/memsys.2015.7050930" @default.
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