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- W2066855194 abstract "• Wafer vibration improvement over 90%. • Wafer Notch Shift improvement 100%. • Reduce Wafer pollution issue by the dust caused by the particles in the wafer POD. • This design can improve wafer yield and saves costs. • The prototype of micro-seismic spring wafer wagon has been applied for Patent." @default.
- W2066855194 created "2016-06-24" @default.
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- W2066855194 date "2011-11-28" @default.
- W2066855194 modified "2023-09-27" @default.
- W2066855194 title "Design and development of an innovative micro-seismic spring wafer wagon and vibration improvement" @default.
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