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- W2066914519 abstract "As a result, low fidelity patterns due to process variations can be detected and eventually corrected by designers as early in the tape out flow as right after design rule checking (DRC); a step no longer capable to totally account for process constraints anymore. This flow has proven to provide a more adequate level of accuracy when correlating systematic defects as seen on wafer with those identified through LFD simulations. However, at the 32nm and below, still distorted patterns caused by process variation are unavoidable. And, given the current state of the defect inspection metrology tools, these pattern failures are becoming more challenging to detect. In the framework of this paper, a methodology of advanced process window simulations with awareness of chip topology is presented. This method identifies the expected focal range different areas within a design would encounter due to different topology." @default.
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- W2066914519 date "2012-03-29" @default.
- W2066914519 modified "2023-10-16" @default.
- W2066914519 title "<title>Thickness-aware LFD for the hotspot detection induced by topology</title>" @default.
- W2066914519 doi "https://doi.org/10.1117/12.917998" @default.
- W2066914519 hasPublicationYear "2012" @default.
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