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• W2067179205 abstract "The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with <TEX>$HNO_3$</TEX> vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without <TEX>$HNO_3$</TEX> vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: <TEX>$(Ni,Cu)_3Sn_4$</TEX> layer, <TEX>$(Ni,Cu)_2SnP$</TEX> layer, and <TEX>$(Ni,Sn)_3P$</TEX> layer. The high speed shear energy of SAC405 solder joint with <TEX>$3{mu}m$</TEX> Ni-P deposit was found to be lower in pre-condition level#2, compared to that of <TEX>$6{mu}m$</TEX> Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of <TEX>$3{mu}m$</TEX> Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the <TEX>$HNO_3$</TEX> vapor treatment." @default.
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• W2067179205 date "2014-06-30" @default.
• W2067179205 modified "2023-10-16" @default.
• W2067179205 title "Effects of the Electroless Ni-P Thickness and Assembly Process on Solder Ball Joint Reliability" @default.
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• W2067179205 doi "https://doi.org/10.5781/jwj.2014.32.3.60" @default.
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