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- W2067568505 abstract "The influence of different Cr content on oxidation resistance, thermal properties, wetting properties, growth of intermetallic compound of Sn-9Zn-3Bi based solder are described herein, and compare with eutectic Sn-9Zn solder. Cr element segregates in the near-surface layer, and improves the oxidation resistance which contributes to better wettability at the meantime. Sn-9Zn-3Bi-0.3Cr solder shows the best oxidation resistance and wetting properties, followed by Sn-9Zn-3Bi-0.1Cr solder. Because of its small amount, Cr addition causes little change in solidus and liquidus temperature of Sn-9Zn-3Bi alloy. Micrographs of Sn-9Zn-3Bi-xCr/Cu interfaces indicate that the addition of Cr can obviously restrain growth of IMCs, and Sn-9Zn-3Bi-0.3Cr alloy has the thinnest thickness of IMCs." @default.
- W2067568505 created "2016-06-24" @default.
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- W2067568505 date "2007-08-01" @default.
- W2067568505 modified "2023-10-16" @default.
- W2067568505 title "Preparation and Properties of Sn-9Zn-3Bi-Cr Based Lead-free Solder" @default.
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- W2067568505 doi "https://doi.org/10.1109/icept.2007.4441466" @default.
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