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• W2067791857 abstract "Insulating materials with ultralow dielectric constants and reasonable mechanical properties for future microelectronic applications are proposed. The structure of the materials is based on ${mathrm{C}}_{60}$ fullerenes interconnected by bridge molecules. Classical and quantum-theoretical methods are used to optimize the structures and to calculate dielectric and mechanical properties. The (static) dielectric constants $k$ and elastic bulk moduli $B$ of the proposed materials are in the range of $k=1.7$ to 2.2 and $B=5$ to $23phantom{rule{0.3em}{0ex}}mathrm{GPa}$, respectively." @default.
• W2067791857 created "2016-06-24" @default.
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• W2067791857 date "2007-06-22" @default.
• W2067791857 modified "2023-09-26" @default.
• W2067791857 title "Structure and properties of computer-simulated fullerene-based ultralow-<mml:math xmlns:mml=http://www.w3.org/1998/Math/MathML display=inline><mml:mi>k</mml:mi></mml:math>dielectric materials" @default.
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• W2067791857 doi "https://doi.org/10.1103/physrevb.75.245430" @default.
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