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- W2067843028 abstract "Technology for high power devices has made impressive progress in increasing the current density of power semiconductor, system module, and design optimization, which realize high power systems with heterogeneous functional integration. Depending on the performance development of high power semiconductor, packaging technology of high power device is urgently required for efficiency improvement of the device. Power device packaging must provide superior thermal management due to high operating temperature of power modules. Here we, therefore, review critical challenges of typical power electronics packaging today including core assembly processes, component materials, and reliability evaluation regulations." @default.
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- W2067843028 date "2014-06-30" @default.
- W2067843028 modified "2023-09-26" @default.
- W2067843028 title "Overview on Thermal Management Technology for High Power Device Packaging" @default.
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- W2067843028 doi "https://doi.org/10.6117/kmeps.2014.21.2.013" @default.
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