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• W2067939792 abstract "The deposition characteristics of copper chemical vapor deposition using the liquid precursor hexafluoro-acetylacetonate-copper (1) trimethylvinylsilane are investigated. The precursor supply is directly controlled by a liquid-injection system. The deposition rate and selectivity on the substrate surface strongly depend on the carrier gas. A hydrogen carrier-gas system has a higher deposition rate and lower selectivity than an argon carrier gas. The deposition rate of copper is proportional to the square root of the precursor partial pressure under reaction-rate-limited conditions at a substrate temperature below 200 °C. In these conditions, a deposition rate of up to 70 nm min−1 and an apparent activation energy of 11 kcal mol−1 has been obtained. Surface morphology and step coverage improves with decreasing substrate temperature and increasing precursor supply. A smooth film with a low resistivity of 2.0 Ω cm can be formed superconformally on the step coverage at a substrate temperature below 180 °C and a high aspect ratio vias can be filled under the optimum deposition conditions." @default.
• W2067939792 created "2016-06-24" @default.
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• W2067939792 date "1995-06-01" @default.
• W2067939792 modified "2023-09-26" @default.
• W2067939792 title "Carrier-gas effects on characteristics of copper chemical vapor deposition using hexafluoro-acetylacetonate-copper (1) trimethylvinylsilane" @default.
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• W2067939792 doi "https://doi.org/10.1016/0040-6090(95)05815-x" @default.
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