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- W2068200722 abstract "An in situ rf sputter precleaning of the GaAs substrate before AuGeNi ohmic metal deposition yields contact resistance Rc=0.11 Ω mm at a peak doping of ∼1018/cm3. Excellent uniformity and thermal stability are achieved across the wafer. The contacts do not deteriorate appreciably after themal treatment at 410 °C for 57 h." @default.
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- W2068200722 date "1985-06-15" @default.
- W2068200722 modified "2023-09-26" @default.
- W2068200722 title "Uniform and thermally stable AuGeNi ohmic contacts to GaAs" @default.
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- W2068200722 doi "https://doi.org/10.1063/1.95736" @default.
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