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- W2068573744 abstract "A new x‐ray topographic camera is described which reduces the exposure time for the production of useful topographs of semiconductor wafers by at least one order of magnitude. The gain is achieved by holding the wafer with a curved vacuum chuck such that rays from a distant point source strike every portion of the wafer at the Bragg angle. Thus the Rowland focusing feature which has previously been used in many x‐ray instruments for spectroscopy and diffractometry has been incorporated in the new camera. Included is an x‐ray topograph of an entire 2 in. silicon wafer made on dental film during a 30 sec exposure." @default.
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- W2068573744 date "1976-03-01" @default.
- W2068573744 modified "2023-09-24" @default.
- W2068573744 title "A High Speed X‐Ray Topographic Camera for Semiconductor Wafer Evaluation" @default.
- W2068573744 doi "https://doi.org/10.1149/1.2132837" @default.
- W2068573744 hasPublicationYear "1976" @default.
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