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- W2068730090 abstract "Three-dimensional MCM (3D-MCM) is an effective method for realizing high-density assembly. In this paper, the fabrications of spacer and solder bumps, the process technology of stacked package for multi-substrates and spacer, as well as the vertical interconnection technology in research of LTCC 3D-MCM are introduced. And also the void of solder bump, the false soldering between vertical interconnection, solder choice for different soldering area in 3D-MCM are analyzed and discussed" @default.
- W2068730090 created "2016-06-24" @default.
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- W2068730090 date "2006-08-01" @default.
- W2068730090 modified "2023-09-30" @default.
- W2068730090 title "The Technique Research on LTCC 3D-MCM" @default.
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- W2068730090 doi "https://doi.org/10.1109/icept.2006.359653" @default.
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