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• W2069161010 abstract "In this paper, an integrated NexFET power module is presented to meet requirements on next-generation, high efficiency and high current density DC-DC converters for computer applications. The new power module uses an innovative stacked-die package technology, implements low Vth power MOSFET in the low-side position, and introduces monolithically integrated components to avoid shoot-through and minimize voltage ringing at the switch node. In synchronous buck application, this power module achieves over 90% efficiency and low switch node ringing at high output current rating (25A) and high operation frequency (1MHz) under 12V input and 1.3V output condition." @default.
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• W2069161010 date "2011-12-01" @default.
• W2069161010 modified "2023-09-26" @default.
• W2069161010 title "NexFET generation 2, new way to power" @default.
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• W2069161010 doi "https://doi.org/10.1109/iedm.2011.6131615" @default.
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