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- W2069651625 abstract "Abstract A BCl3/Ne plasma chemistry was used to etch Ga-based (GaAs, AlGaAs, GaSb) and In-based (InGaP, InP, InAs and InGaAsP) compound semiconductors in a planar inductively coupled plasma (ICP) reactor. The addition of the Ne allows the plasma to maintain high ion density conditions over a broader range of operating pressures. All of the materials exhibit a maximum etch rate at BCl3-to-Ne ratios of 0.25–0.5. Under all conditions, the Ga-based materials etched at significantly higher rates than the In-based materials, due to the higher volatilities of their trichloride etch products relative to InCl3. The etched surfaces of both AlGaAs and GaAs have comparable root-mean-square (rms) roughness and similar stoichiometry to the unetched control samples, while the surfaces of In-based materials are degraded by the BCl3/Ne etching. Etch anisotropy of the GaAs and AlGaAs relies on some degree of sidewall passivation by redeposition of etch products and photoresist from the mask." @default.
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- W2069651625 date "2004-01-01" @default.
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- W2069651625 title "BCl3/Ne etching of III–V semiconductors in a planar inductively coupled plasma reactor" @default.
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- W2069651625 doi "https://doi.org/10.1016/j.apsusc.2003.08.009" @default.
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