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- W2070139467 abstract "AbstractModern electronics require better thermal management technologies to ensure long lifetime stability and reliable working. Aiming to evaluate the feasibility for a loop heat pipe being used for the heat dissipation of electronics, a stainless-steel/water loop heat pipe is design and an experimental system to study its heat transfer performance is set up. Experimental results show that at optimal heat load and with the loop heat pipe being aligned perpendicularly to the horizontal plane, its thermal resistance is lowered to be ∼0.27 K/W. The loop heat pipe also shows good startup characteristics and can steadily work as well. All these indicate that the loop heat pipe has the potential to be a good solution for cooling of modern electronics.Keywords:: loop heat pipecooling of electronicsheat dissipation FundingFinancial support for this study received from the Guangdong Science and Technology Project (2010A080802017 and 2012A080304002), the CAS Key Laboratory of Renewable Energy and Gas Hydrate Foundation (y207j7), the ZhuHai Science and Technology Project (2012D0501990019), and the CAS “100 Talents” Program (FJ) is gratefully acknowledged.NotesColor versions of one or more of the figures in the article can be found online at www.tandfonline.com/ueht" @default.
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- W2070139467 date "2014-07-31" @default.
- W2070139467 modified "2023-10-03" @default.
- W2070139467 title "An Experimental Study on the Performance of a Loop Heat Pipe" @default.
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- W2070139467 doi "https://doi.org/10.1080/08916152.2013.797942" @default.
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