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- W2070217739 abstract "Cyclic voltammetry (CV) and electrochemical quartz crystal microgravimetry (EQCM) were used to study the reactions in a new type autocatalytic (electroless) copper deposition system using cobalt(II)–ethylenediamine complex as a reducing agent. The rates of Co(II) oxidation and Cu(II) reduction (partial reactions of the autocatalytic process) as well as those of Cu anodic dissolution and Co(III) reduction were measured both in separate Co(II)–En, Cu(II)–En, and in complete electroless plating systems (pH 6–8) as a function of Cu potential (from −0.4 to 0.05 V vs. SHE), in unstirred solution and under flow-through (wall-jet) conditions. The experimental results show that the autocatalytic process results from a coupling of partial electrochemical reactions of Co(II) oxidation and Cu(II) reduction on the Cu surface, some deviations from partial reactions additivity being explained by ligand (En) concentration changes at the Cu surface in the separate solutions of Co(II) and Cu(II) and in the complete system. The Co(II) oxidation rate increases with the solution pH alongside the increase in CoEn32+ complex concentration in the solution. The partial reaction rate increases remarkably at solution flow conditions, this effect being related both to the transport of reacting Cu(II) and Co(II) species to the electrode, and to the removal of Co(III) species from the Cu surface. Chloride ions possibly act as a bridge between reacting complex species and the Cu electrode." @default.
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- W2070217739 date "1999-04-01" @default.
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- W2070217739 title "Cyclic voltammetry and quartz crystal microgravimetry study of autocatalytic copper(II) reduction by cobalt(II) in ethylenediamine solutions" @default.
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- W2070217739 doi "https://doi.org/10.1016/s0022-0728(99)00073-x" @default.
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