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- W2070476338 abstract "This paper proposes high-Q distributed constant passive devices using wafer-level chip scale package (WL-CSP) technology, which can be realized on a Si CMOS chip. A 90° directional coupler using the WL-CSP technology has center frequency of 25.6 GHz, insertion loss of -0.5 dB and isolation of -29.8 dB in the measurement result. The WL-CSP technology contributes to realize low-loss RF passive devices on Si CMOS chip, which is indispensable to achieve small-size, cost-effective and low-power monolithic wireless communication circuits (MWCCs)." @default.
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- W2070476338 date "2007-03-01" @default.
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- W2070476338 title "Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology" @default.
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- W2070476338 doi "https://doi.org/10.1093/ietele/e90-c.3.641" @default.
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