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• W2070963527 abstract "Effects of additives, Cu and Ni, on intermetallic compound formation at the interface between Sn–Zn-based solder and Cu substrate have been studied. (Sn91Zn9)99.98−xMxAl0.02 (wt.%) solder (M = Cu or Ni) alloys were prepared. The microstructures of the samples after annealing at 120 °C for 100 h were investigated using a scanning electron microscope, and the melting temperatures of the alloys were measured with a differential scanning calorimeter for different Cu or Ni contents. Although the melting (liquidus) temperature increases up to about 210–220 °C by alloying Cu or Ni of 2.6–2.7 wt.% to the solder, the well-known formation of intermetallic compounds, Cu5Zn8 and Sn6Cu5, are found to be significantly restrained." @default.
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• W2070963527 date "2005-04-01" @default.
• W2070963527 modified "2023-09-23" @default.
• W2070963527 title "Control of compound forming reaction at the interface between SnZn solder and Cu substrate" @default.
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• W2070963527 doi "https://doi.org/10.1016/j.jallcom.2004.09.043" @default.
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