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- W2071201731 abstract "A void pattern in Sn4Ag0.5Cu solder joints under EM stressing was empirically obtained at the under bump metallization/intermetallic compound (UBM/IMC) interface. The pattern was associated with current crowding and consumption of the UBM layer. A kinetic model was employed and modified to describe the void propagation at UBM/IMC interface. Based on the continuity condition, the void growth velocity was calculated. The analytical results were in good agreement with the experimental data." @default.
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- W2071201731 date "2010-05-01" @default.
- W2071201731 modified "2023-09-27" @default.
- W2071201731 title "Modeling of electromigration on void propagation at the interface between under bump metallization and intermetallic compound in flip-chip ball grid array solder joints" @default.
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- W2071201731 doi "https://doi.org/10.1063/1.3369442" @default.
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