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- W2071526508 abstract "This paper reports a micromachined sensor for the direct in situ monitoring of polymer film thickness in plasma-etching systems. An electrothermal oscillator measures the thermal mass change as polymer builds up on a stress-compensated dielectric window containing metal-film heating and sensing resistors. The change in the thermal mass of the window can be detected as a variation in the pulse width (cooling time) of the oscillation. The device operates with a typical cooling time of 2.7 ms, which agrees well with SPICE simulations, and has a measurement resolution of < 1 nm. The dielectric windows are 0.5 mm on a side; the overall die size is 3.5 mm × 7.5 mm. A chevron-based support structure allows the device to be held in wafer form after micromachining for testing, high-yield die separation, and non-lithographic post-EDP processing. The exposed window area is protected by a thin film of low-stress iridium against damage by the plasma." @default.
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- W2071526508 date "1998-04-01" @default.
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- W2071526508 title "Electrothermal oscillator for film-thickness monitoring" @default.
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- W2071526508 doi "https://doi.org/10.1016/s0924-4247(97)01716-0" @default.
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