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- W2071718510 abstract "This work studied the amount of copper deposited by immersion plating onto porous silicon, in oxygen-free atmosphere. The two parameters varied were the porous silicon (PS) layer thickness and the immersion time. The amount of deposited copper depends significantly on both of these two parameters. Since the PS thickness corresponds to a variation of the oxidisable sites per deposition area, we introduce the specific deposition (mass of deposited copper divided by PS thickness) to compare the degree of oxidation of the PS layer. The results indicate that the specific deposition is maximum for porous layer around 7 µm, in which the oxygen concentration is constant in depth. (© 2005 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)" @default.
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- W2071718510 date "2005-06-01" @default.
- W2071718510 modified "2023-09-27" @default.
- W2071718510 title "Specific deposition of copper onto porous silicon" @default.
- W2071718510 doi "https://doi.org/10.1002/pssc.200461157" @default.
- W2071718510 hasPublicationYear "2005" @default.
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