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• W2071766988 abstract "The aim of this work is to model the structural relaxation of a fully cured epoxy resin. The samples were subjected to thermal treatments involving isothermal annealing at temperatures Ta for times ta before the measuring scan carried out on heating in the DSC. The values of Ta ranged between Tg −8 and Tg −50°C and those of ta between 0 and 16000 min. A new model based on the evolution of the configurational entropy was used to simulate the experimental data, obtained previously by one of the authors. A curve of calorimetric relaxation times as a function of reciprocal temperature and the β parameter of the KWW equation were determined from a comparison between experimental and calculated thermograms. Using the peak shift method, the Narayanaswamy parameter x was determined from both the experimental and simulated scans. The calorimetric relaxation times are compared with those found for dielectric and dynamic-mechanical relaxation." @default.
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• W2071766988 date "1998-06-01" @default.
• W2071766988 modified "2023-10-17" @default.
• W2071766988 title "The application of a new configurational entropy model to the structural relaxation in an epoxy resin" @default.
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• W2071766988 doi "https://doi.org/10.1016/s0032-3861(97)10327-5" @default.
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