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- W2072814619 abstract "스마트폰 배터리 사용시간이 짧아지는 문제의 해결방안으로 PMP(Protection Module Package)를 제안한다. PMP란 보호회로가 하나의 반도체로 구성하는 것을 의미한다. 이번 연구에서는 유한요소 해석을 통하여 EMC 모듈의 적합한 Epoxy 재질을 선정하기 위한 기반연구를 수행하였다. 먼저 굽힘강도 해석을 통하여 외부 힘에 대한 응력을 비교하였다. 다음 열해석에서, 계산한 발열량을 사용하여 EMC 모듈의 내부 부품의 온도 변화를 비교한다. 마지막으로, 충전률은 EMC 모듈 내의 용융된 에폭시를 주입하여 비교하였다. 【The use of the PMP (Protection Module Package) was proposed as a solution for the shorter battery lifetime. The PMP means that a protection circuit consists of a semiconductor single. In this study, basic research was carried out to select a suitable epoxy material of the EMC module through finite element analysis. First, the stress on the external force was compared by the flexural strength analysis. In the following thermal analysis, the temperature change of the EMC module and the internal part was compared using the calculated heating value. Finally, the filling ratio was compared with the injection of the melting epoxy in the EMC module.】" @default.
- W2072814619 created "2016-06-24" @default.
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- W2072814619 date "2014-11-30" @default.
- W2072814619 modified "2023-09-24" @default.
- W2072814619 title "Finite Element Analysis of an EMC Module for Selecting Epoxy" @default.
- W2072814619 cites W1981849492 @default.
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- W2072814619 doi "https://doi.org/10.5762/kais.2014.15.11.6419" @default.
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