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- W2073036706 abstract "The advantages of single-ended transmission lines are their simplicity and high flexibility of interconnection. Generally, shielding with additional ground lines is essential to improving the immunity of single-ended RF/high-speed signals against noise. However, this approach is very difficult to realize for a single-ended through silicon via (TSV) in 3D ICs because of the strong dependence of characteristic impedance on the number of ground TSVs. To address this issue, this work provides a physical and scalable equivalent-circuit model of a signal TSV that is circularly surrounded by multiple ground TSVs. Additionally, with the help of a double-sided probing system, wideband measurements of S-parameters of up to 40 GHz and eye-diagrams of 40 Gb/s signal are made to validate the modeled results." @default.
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- W2073036706 date "2012-05-01" @default.
- W2073036706 modified "2023-10-17" @default.
- W2073036706 title "Scalable modeling and wideband measurement techniques for a signal TSV surrounded by multiple ground TSVs for RF/high-speed applications" @default.
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- W2073036706 doi "https://doi.org/10.1109/ectc.2012.6248961" @default.
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