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- W2073042893 abstract "This paper studies the feasibility of using titanium and nickel silicide thin films as mask materials for silicon bulk micro-machining. Thin films of nickel silicide were found to be more resistant to wet etching in potassium hydroxide. The use of nickel silicide as a structural material, by fabricating micro-beams of varying dimensions, is demonstrated. The micro-structures were realized using these thin films with wet etching using potassium hydroxide solution on (1 0 0) and (1 1 0) silicon substrates. These results show that nickel silicide is a suitable alternative to silicon nitride for silicon bulk micro-machining." @default.
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- W2073042893 date "2008-07-24" @default.
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- W2073042893 title "Nickel silicide thin films as masking and structural layers for silicon bulk micro-machining by potassium hydroxide wet etching" @default.
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- W2073042893 doi "https://doi.org/10.1088/0960-1317/18/9/095002" @default.
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